US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits
Learn more about benefits at Google.
Responsibilities
- Develop and sustain new processes associated with thin film deposition tools including sputtering, PECVD, e-beam, PVD, and others.
- Manage process control and defectivity reduction to deliver yield improvements.
- Work with the Process Engineering team to select our next-generation of tools needed for volume manufacturing.
- Collaborate with the Integration team to develop new process capabilities that address new design requirements.
Minimum qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
- 5 years of experience in the semiconductor industry maintaining equipment, such as ICP, PVD, or CVD.
- Experience with conventional microfabrication techniques, including lithography, etch, thin-film deposition, and metrology.
- Experience with data analysis and reporting.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
- Experience in data analysis in quality reliability (tools like JMP).
- Experience with microdisplay or microLED technology.
- Understanding of statistical process control and process improvement, including implementation experience.