In This Role, You Will
- Lead the SI/PI architecture and define constraints for next-generation, high-complexity, high-density printed circuit boards (PCBs) and overall system design.
- Collaborate at an architectural level with hardware design, silicon vendors, PCB layout, and mechanical engineering teams to define layer stack-ups, routing strategies, component placement, and power delivery architectures.
- Analyze, optimize, and sign off on advanced high-speed serial links (PCIe, Ethernet, MIPI, GMSL) and memory interfaces (LPDDR).
- Provide expert-level design guidance and validation for automotive-specific communication and audio protocols (A2B).
- Architect and conduct comprehensive Power Delivery Network (PDN) analysis, including DC IR drop, AC impedance modeling, and transient response analysis to ensure stable power delivery across complex multi-board systems.
- Drive the development of advanced SI/PI routing rules, simulation methodologies, automation scripts, and sign-off processes for the hardware engineering department.
- Tackle the most complex, unprecedented signal and power integrity challenges, performing hands-on root-cause analysis, lab measurements, and correlating simulation models with real-world testing.
- Act as a technical mentor and subject matter expert, elevating the SI/PI capabilities of the entire hardware organization and guiding junior to senior engineers.
Qualifications
- Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Computer Engineering, Physics, or a closely related technical field.
- 10+ years of proven industry experience in signal and power integrity analysis for complex high-speed digital designs.
- Extensive, proven track record designing, simulating, and troubleshooting high-speed interfaces, specifically PCIe, multi-gigabit Ethernet, MIPI (CSI/DSI), and GMSL, through multiple successful product lifecycles.
- Deep expertise in memory interface design and simulation, with a strong focus on advanced LPDDR technologies.
- Familiarity with automotive audio and sensor bus protocols, such as A2B.
- Advanced proficiency with industry-standard 2D/3D electromagnetic extraction and SI/PI simulation tools (e.g., Ansys HFSS/SIwave, Keysight ADS, Cadence Sigrity, or Siemens EDA/HyperLynx).
- Mastery of electromagnetics, transmission line theory, cross-talk, jitter, and advanced PDN design principles.
- Expert-level hands-on experience with high-speed lab characterization equipment, including Vector Network Analyzers (VNAs), Time-Domain Reflectometers (TDRs), and high-bandwidth oscilloscopes.
Bonus Qualifications
- Direct experience in the automotive industry, particularly developing hardware for advanced driver-assistance systems (ADAS) or autonomous vehicles.
- Deep understanding of automotive reliability standards, compliance requirements, and designing for harsh environmental operating conditions.
- Extensive experience with high-layer-count HDI (High-Density Interconnect) PCB design, advanced packaging, and pushing the boundaries of modern fabrication capabilities.
- Proven ability to influence technical strategy, drive cross-functional alignment, and clearly communicate complex technical trade-offs to executive and non-SI/PI stakeholders.