Electrical Manufacturing Engineer III, PIE AOE

As an Electrical Manufacturing Engineer in the Platforms Infrastructure Engineering (PIE) Advanced Operations Engineering (AOE) team, you evaluate product designs and create the processes, tools, and procedures that power Google’s technical infrastructure, while serving as an onsite technical expert to ensure manufacturing processes are repeatable and controlled when partners produce components. You collaborate with cross-functional engineers to determine infrastructure needs and product specifications, leading the development and scale of new PCBA manufacturing and materials technologies for Google Cloud data center products as part of the New Technology Introduction process. Ultimately, your work provides technical leadership for cutting-edge approaches to release hardware to mass production, developing the supply chain, and ensuring that all pieces of Google’s infrastructure fit together to keep systems running smoothly for a seamless user experience.

Our Platforms Infrastructure Engineering team designs and builds the
hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of Google users.

Responsibilities

• Support Advanced Manufacturing Engineers in developing, defining, and qualifying industry-first manufacturing processes.
• Plan and implement innovative processes into established production and capacity workflows to hit forecast targets.
• Create critical manufacturing documentation, including Bills of Materials (BOM), assembly drawings, and work instructions.
• Establish and maintain manufacturing and quality standards for new technologies using existing tools.
• Collaborate with design teams and manufacturing partners on Design for Excellence (DfX), build readiness, and solve design/process challenges for NPI launches

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
• 2 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology.
• Experience with development of PCBA manufacturing processes including acceptance testing, startup, and qualification.
• Experience in new site/line/equipment bring-up/transfer and qualification for PCBA and system integration.

Preferred qualifications:

• Master’s degree in Mechanical, Industrial, or Electrical Engineering, or a related discipline.
• Experience with Product Data Management (PDM) tools (e.g., SAP, Agile, Windchill).
• Experience developing solid, effective technical relationships with contract manufacturers and vendors.
• Experience in SMT manufacturing and process development for datacenter hardware, including applying DFM, DOE, thermo-mechanical dynamics, and process optimization.
• Ability to drive root cause analysis, corrective actions, and continuous process improvements with cross-functional teams, contract manufacturers, and suppliers.
• Demonstrate ability to communicate effectively with multi-geographic teams, collaborate to achieve project goals, contribute positively to the engineering community, manage complex projects spanning multiple technologies.